MediaTek officially announced its Dimensity 9000+ chipset, a half-step upgrade to its existing Dimensity 9000 processor for flagship Android phones.
The new system-on-chip (SoC) packs Arm’s v9 CPU architecture with a 4nm manufacturing process, giving its users an octa-core layout with one ultra-Cortex X2 core (clocked up to 3.2GHz), three big Cortex-A710 cores, and four small Cortex-A510 cores. The built-in graphics component is an Arm Mali-G710 GPU.
Taken together, MediaTek said that the Dimensity 9000+ offers 5% better CPU performance and 10% better GPU performance than its predecessor, the Dimensity 9000.
Prior to its official announcement, leaked benchmark scores of the Dimensity 9000+ pitted the processor against Qualcomm's Snapdragon and Apple's A-series Bionic processors.
The integrated LPDDR5X RAM supports 8MB L3 CPU cache and 6MB of system cache, on top of relying on MediaTek’s 5th-gen Application Processor Unit for AI computing capabilities.
The built-in image signalling processor (ISP) for cameras is the MediaTek Imagiq 790, which supports image sensors that offer 320MP, 18-bit HDR video recording, and AI noise reduction for 4K HDR video.
Dimensity 9000+’s modem supports sub-6GHz 5G (up to 7Gbps download speeds with 3CC carrier aggregation). It also supports 5G/4G Dual-SIM Dual-Active (two live SIMs).
Finally, it also supports up to Wi-Fi 6E connectivity, Beidou III- BIC GPS, and Bluetooth 5.3, should phone manufacturers choose to integrate the latest wireless technologies into the device.
MediaTek also said that phones featuring Dimensity 9000+ would start appearing from Q3 2022 onwards.